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Semiconductors & Chipmaking · Recorded milestone

3D-stacked chiplets

Recorded year2022

Logic and memory dies stack vertically with dense bonding, the main route to more compute per package.

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Built on

Integrated circuitRecorded · 1958enables
Copper chip wiringRecorded · 1997enables
AI accelerator chipsRecorded · 2016enables
Chiplet processorsRecorded · 2017enables

Led to

Co-packaged photonicsRecorded · 2025enables
Glass-core chip packagesForecast · ~2027enables
Expert-level general AIForecast · ~2028enables
Private general AI on your own deviceForecast · ~2031enables
Zettascale supercomputersForecast · ~2035enables
Human brain mappedForecast · ~2060enables

Sources & evidence

Additional source

Dataset updated 2026-10-18. This individual record has not been separately re-reviewed.